University of Sindh, Thatta Campus — Open Tender for Repair & Maintenance Works (Est. Rs. 20,145,616)
University of Sindh, Thatta Campus · Thatta · Jang,
Tender advertisement published in Jang on Monday, 5 October 2026, listed under Thatta. Issued by University of Sindh, Thatta Campus. The last date printed on the advertisement is Tuesday, 27 October 2026.
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Issuer: University of Sindh, Thatta Campus. Sealed bids are invited for a building repair and maintenance works package under the EPADS e-procurement system in accordance with SPPRA rules.
| Package | Estimated Cost (Rs.) | Bid Security (Rs.) | Tender Fee (Rs.) | Completion Period | Sale Closes | Submission / Opening |
|---|---|---|---|---|---|---|
| Repair, renovation and allied works (Thatta Campus) | 20,145,616 | 1,007,280 | 5,000 | 6 months | 2026-10-09 | 2026-10-27, 11:30 AM |
How to apply: Tender documents and submission are handled through the EPADS/e-procurement portals (portal.sindh eprocure / university tender notice pages). Bidders must comply with SPPRA requirements and provide required bid security and documents. Electronic pre-qualification and bid submission procedures apply as indicated by the issuer.
Contact: Mukhtar Mahar, University of Sindh (email: [email protected]; phone available from the university office).
Published in Jang on Monday, 5 October 2026. DailyAds.pk indexes newspaper advertisements; the original notice and the issuing organisation remain the source for final terms and eligibility.
Questions about this tender
- What is the last date for this tender?
- The advertisement prints Tuesday, 27 October 2026.
- Which newspaper published this tender?
- Jang, in the edition of Monday, 5 October 2026.
- Which city is this tender listed under?
- Thatta. That is the city recorded for this advertisement — taken from the notice where it names a place, and otherwise from the newspaper edition it appeared in.
- How do I respond to this tender?
- Follow the instructions printed in the clipping; the advertiser’s own page is linked from this one. Applications are not submitted through this page.